Advanced Mobile Phone Repair Course in Guwahati

Become a certified expert in smartphone motherboard and chip-level repair.

Mobile Phone Repair Course Overview

Comprehensive training in advanced mobile phone repair techniques

Course Duration

3 Months Intensive Program

Eligibility

10th Pass & Basic Electronics Knowledge

Course Mode

Offline (Guwahati) & Online Options Available

Mobile Phone Repair Course Curriculum

Comprehensive modules covering all aspects of mobile phone repair

Basics of Mobile Phones

Introduction to smartphone components, tools, and safety procedures.

Circuit Tracing

Learn to read schematics and trace circuits on motherboards.

Motherboard Diagnosis

Advanced techniques for diagnosing motherboard issues.

Chip-Level Soldering

Master BGA rework, micro-soldering, and component replacement.

Power Section Repair

Troubleshoot and repair power management circuits.

Charging IC Repair

Fix common charging port and IC related issues.

Audio/Video Issues

Repair speaker, microphone, and display problems.

UFS/EMMC Repair

Data recovery and storage chip replacement techniques.

Software Flashing

Install firmware, remove FRP, and solve software issues.

Why Choose Our Advance Mobile Phone Repair Course?

We provide the best training experience with industry-leading facilities

Certificate Included

Get a recognized certification upon course completion.

100% Practical Training

Hands-on experience with real devices and problems.

Latest Repair Tools

Access to modern equipment and diagnostic tools.

Experienced Instructors

Learn from industry experts with 10+ years experience.

Lifetime Support

Technical assistance even after course completion.

FAQ

What is this Mobile Phone Repair Course about?

This course teaches complete mobile repairing skills, including hardware and software troubleshooting. Students learn theory, practical repair techniques, IC reworking, motherboard analysis, and advanced smartphone diagnostics.

Who can join this course?

Anyone interested in mobile repairing can join — students, job seekers, shop owners, and working professionals. No technical background is required.

What is the duration of the course?

The course duration usually ranges from 1 month to 3 months, depending on the selected level (Basic / Advanced / Chip-Level).

Will I get a certificate after completing the course?

Yes, after successful completion, you will receive a Government/Institute-Recognized Certificate that can help you start your repair career or business.

Do you provide practical training?

Yes. Hands-on practice is a core part of the training. Students repair real mobile phones, use professional tools, and learn live troubleshooting.

What is the fee for the course?

Course fees vary depending on the selected level. Please contact us or visit the institute for the latest fee structure and offers.

Do you provide job placement or business guidance?

Yes. We help students with:

Placement support in service centers
Business setup guidance
Wholesale tools and spare parts suppliers list

Advanced Mobile Phone Repair Technician Syllabus

Course Overview: This advanced mobile phone repair course in guwahati at Datacom Institue is designed for experienced repair technicians seeking to elevate their skills to a professional, component-level standard. The curriculum delves deep into electronic theory, schematic reading, micro-soldering techniques, complex diagnostics, and the repair of intricate subsystems like baseband, RF, and power management. Graduates will be equipped to handle data recovery, liquid damage restoration, and business-critical repairs that are beyond the scope of most repair shops.

Module 1: Advanced Electronics & Schematic Analysis

Learning Objectives: Understand the core electronic principles that govern modern smartphones and learn to use service documentation as a roadmap for repair.

Topic 1.1: Deep Dive into Smartphone Architecture
- System-on-a-Chip (SoC) breakdown: CPU, GPU, NPU, ISP.
- Memory hierarchy: NAND Flash, DRAM, and their interfaces.
- Understanding the Printed Circuit Board (PCB): Multi-layer boards, blind and buried vias.
Topic 1.2: Advanced Component Recognition & Function
- Integrated Circuits (ICs): BGA, QFN, CSP packages.
- Passive Components: Resistors, Capacitors (MLCC, Tantalum), Inductors, and Diodes.
- Active Components: MOSFETs (P-Channel & N-Channel), Regulators (LDOs), and Crystal Oscillators.
Topic 1.3: Schematic & Boardview Navigation
- How to source and use official schematics, boardview (.brd, .f2b), and PCB layout files.
- Interpreting symbols, net names, and power rails.
- Tracing signals from a fault back to the source using documentation.
Practical Lab:
- Identify 20 critical components on a donor board using a schematic.
- Trace the power path from the charging port to the battery.

Module 2: Micro-Soldering & BGA Rework Mastery

Learning Objectives: Develop the high-precision hand skills required for soldering and de-soldering miniature components.

Topic 2.1: Advanced Tools of the Trade
- Microscope Use: Optimal lighting, magnification, and ergonomics.
- Temperature-Controlled Soldering Irons: Fine tip selection and temperature profiles.
- Hot Air Rework Stations: Nozzle selection, airflow, and temperature calibration for different ICs.
- Jigs and Fixtures: Securing the board without causing damage.
Topic 2.2: Component-Level Soldering Techniques
- Tack Soldering for tiny capacitors and resistors.
- Drag Soldering for fine-pitch connectors.
- Using Solder Paste and Stencils for multi-component replacement.
Topic 2.3: BGA Chip Removal and Installation
- Theory of BGA soldering: Ball grid array, reflow process.
- Proper IC underfill removal and application.
- Step-by-step process: Flux application, even heating, “lift” test.
- Reballing: Using jigs and manual techniques to replace solder balls.
Topic 2.4: Board Preparation & Pad Repair
- Cleaning and re-tinning pads.
- Identifying and fixing lifted pads.
- Running jumpers (using magnet wire) for broken traces.
Practical Lab:
- Remove and reinstall a small BGA IC (e.g., a Power Management IC – PMIC).
- Perform a pad repair on a lifted connection.
- Reball a donor chip using a stencil.

Module 3: Power Management & Charging Systems

Learning Objectives: Diagnose and repair complex power-related failures, from no-power conditions to fast charging issues.

Topic 3.1: Power Distribution Network (PDN)
- Mapping the main power rails (e.g., VDD_MAIN, PP_BATT_VCC).
- Understanding the role of the Primary PMIC and Secondary PMICs.
- Sequencing: The critical order in which power rails turn on.
Topic 3.2: Advanced Charging Circuit Diagnostics
- USB-C Controller (UFP/DFP) and Charging IC communication.
- Fast Charging Protocols: Qualcomm Quick Charge, USB Power Delivery (PD), proprietary protocols.
- Troubleshooting Tristate Charging Ports.
Topic 3.3: Battery Circuit & Fuel Gauge
- How the Battery Management Unit (BMU) and Fuel Gauge IC work.
- Calibration and data line communication (SMBus, I2C).
- Repairing “Battery Health Not Available” or inaccurate percentage issues.
Practical Lab:
- Use a DC Power Supply to inject voltage and find a short on a power rail.
- Diagnose and repair a phone that does not fast charge.

Module 4: RF & Baseband Repairs (Cellular, Wi-Fi, Bluetooth)

Learning Objectives: Diagnose and repair faults in the cellular and wireless communication systems.

Topic 4.1: Cellular Signal Path
- Antenna Switch Modules (ASM), Power Amplifiers (PA), Low-Noise Amplifiers (LNA), and Transceivers.
- Baseband Processor and its relationship with the RF system.
- Common faults: “No Service,” “Searching…,” weak signal.
Topic 4.2: Wi-Fi & Bluetooth Co-Existence
- Combined Wi-Fi/Bluetooth ICs and their interfaces (PCIe, SDIO).
- Diagnosing grayed-out toggles, failure to enable, or weak connectivity.
Topic 4.3: Introduction to Baseband EEPROM
- The concept of IMEI and baseband firmware.
- Causes of “Invalid IMEI” or “No Baseband” and potential repair strategies (including chip replacement/reprogramming).
Practical Lab:
- Use a known-good antenna to bypass a suspected faulty ASM.
- Measure RF power rail voltages to diagnose a “No Service” issue.

Module 5: Specialized Repairs & Emerging Technologies

Learning Objectives: Address complex, multi-faceted failures and understand the repair landscape for new device types.

Topic 6.1: Advanced Liquid Damage Restoration
- Corrosion mapping and advanced cleaning techniques (ultrasonic, specialized chemicals).
- Identifying and repairing corrosion-damaged passive components and board traces.
Topic 6.2: Biometric System Repair
- Fingerprint Sensors (Capacitive, Ultrasonic): Calibration and replacement protocols.
- Face ID (TrueDepth Camera): Dot Projector, Flood Illuminator, and IR Camera repair. Understanding serialization and component matching.
Topic 6.3: Camera System Deep Dive
- Multi-camera arrays and their controllers.
- Diagnosing focus (OIS/VCM), image stabilization, and image processing faults.
Topic 6.4: Foldable & Dual-Screen Devices
- Unique challenges: Flexible displays, hinge mechanisms, and complex ribbon cable routing.
- Diagnosis and safe disassembly procedures.

Module 6: Business, Troubleshooting & Professional Practices

Learning Objectives: Develop a systematic approach to diagnostics and understand the business of running an advanced repair service.

Topic 7.1: The Scientific Method of Diagnostics
- Developing a logical, step-by-step diagnostic flowchart.
- Using Amperage Draw on a DC Power Supply to diagnose boot stages.
- Using Thermal Imaging to locate short circuits.
Topic 7.2: Quality Control & Customer Communication
- Pre-and-post repair checklists.
- How to quote for advanced repairs and manage customer expectations on data recovery.
- Warranty policies for board-level work.
Topic 7.3: Sourcing & Inventory Management
- Identifying reliable sources for ICs and donor boards.
- Managing an inventory of salvaged components.

Our Advantages

What makes us the best choice for mobile repair training in Guwahati

Placement Assistance

We help our students find job opportunities in the industry.

Advanced Lab

State-of-the-art laboratory with the latest equipment.

Affordable Fees

Quality education at reasonable prices with EMI options.

Small Batch Size

Limited students per batch for personalized attention.

Career Opportunities

Multiple career paths after completing our advanced mobile repair course at Datacom Institute , Guwahati

Mobile Repair Technician

Work in service centers or start your own repair business.

Service Center Owner

Establish and manage your own mobile repair service center.

Freelance Engineer

Offer specialized repair services to multiple clients.

Technical Trainer

Teach mobile repair skills to aspiring technicians.

Meet Your Instructor

Learn from an industry expert with extensive experience

Meet Your Instructor

Senior Mobile Repair Specialist

With over 10 years of experience in mobile phone repair and chip-level servicing, Rajesh has trained hundreds of students who are now successful technicians across Northeast India.

He specializes in advanced motherboard repair, data recovery, and has worked with all major smartphone brands including Apple, Samsung, Xiaomi, and OnePlus.

Motherboard Repair Chip-Level Soldering Data Recovery iPhone Repair Android Repair